| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device suitable for reduction in thickness, and a manufacturing method thereof. SOLUTION: In a semiconductor device 5, an island portion 10 is constituted at the center part of a plurality of inner leads 11 radially extending from the center and having cut portions 11a at intermediate parts thereof. The island portion 10 is supported by a suspension lead 12, and a semiconductor chip 7 is loaded on the island portion 10. An electrode 16 on the semiconductor chip 7 and peripheral portions of the inner leads 11 are electrically connected to each other by a gold wire 9, and these are sealed by resin 8. |
