| 摘要 |
PROBLEM TO BE SOLVED: To attain both the excellent protection and the thickness of an element by a single coating operation without depending upon machining or molding by depositing a drop of a resin onto a semiconductor chip arranged onto an insulating film and connecting wires penetrated through holes in the periphery of the chip. SOLUTION: One or more of semiconductor chips 11 arranged on an insulating film 20 supporting electric contacts 30 are fitted, and the semiconductor chips 11 are connected to the electric contacts 30 by connecting wires 12 penetrated through holes 21 formed to the insulating film 20. In the coating method of such an electronic element 10, the holes 21 are bored into the insulating film 20 in the periphery of regions for receiving the semiconductor chips 11, and the semiconductor chips 11 are disposed onto the insulating film 20 in the regions. The connecting wires 12 are connected among the semiconductor chips 11 and the electric contacts 30, a drop of a resin 13 is deposited on the semiconductor chips 11 and the connecting wires 12, and the drop displays an external shape constituted of the holes 21. |
