| 发明名称 |
Process of making an integrated circuit chip composite including parylene coated wire |
| 摘要 |
A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.
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| 申请公布号 |
US5622898(A) |
申请公布日期 |
1997.04.22 |
| 申请号 |
US19950445381 |
申请日期 |
1995.05.19 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ZECHMAN, JOHN H. |
| 分类号 |
H01L21/60;H01L23/29;H01L23/31;H01L23/49;H01L23/495;H01L23/552;H01L23/64;(IPC1-7):H01L21/56 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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