Apparatus for cooling of chips using a plurality of customized thermally conductive materials
摘要
The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.
申请公布号
US5623394(A)
申请公布日期
1997.04.22
申请号
US19960690883
申请日期
1996.08.02
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
SHERIF, RAED A.;COURTNEY, MARK G.;EDWARDS, DAVID L.;FAHEY, ALBERT J.;HOPPER, GREGORY S.;IRUVANTI, SUSHUMNA;JONES, CHARLES F.;MESSINA, GAETANO P.
