发明名称 Soldeerelement.
摘要 The invention relates to a solder element for making electrically conducting connections on either side of a printed circuit board, comprising an electrically conducting wire which is provided with at least one body composed of solder material and flux material, wherein the body is preferably composed of solder material and provided with a recess in which the flux material is received, or the flux material is preferably accommodated between two bodies of solder material arranged on the wire.
申请公布号 NL1001453(C2) 申请公布日期 1997.04.22
申请号 NL19951001453 申请日期 1995.10.20
申请人 WITMETAAL B.V. 发明人 PAUL WILLEM GODIJN;MARTINUS ADRIANUS OUD;JAN DEKKER;ANTONIUS JOHANNES WELLING;JOHANNES CORNELIS DE KEIZER
分类号 H01R12/04;H01R12/32;H05K1/11;H05K3/34;H05K3/40;(IPC1-7):H01R9/09 主分类号 H01R12/04
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