APPARATUS AND PROCESS FOR GRINDING BACK SIDE OF WAFER WITH NO COATING FILM

摘要

PROBLEM TO BE SOLVED: To polish the back face of a wafer without generating pressure damage to an integrated circuit chip at the front face of a silicon wafer and without allowing the pollution of the integrated circuit chip and a related metal bonding pad during a polishing process. SOLUTION: A polishing device includes a plurality of chuck tables 32 for fixing a plurality of wafers 14. Each chuck table includes a cushioning rubber pad 40 fixed to the table, and the boundary surface to the front face of the wafer. During a polishing process, an organic acid coolant is used to prevent the adhesion of silicon grain and a residue to the metal bonding pad of an integrated circuit chip.