发明名称 |
Paddleless molded plastic semiconductor chip package |
摘要 |
Disclosed is a semiconductor package and method in which a semiconductor chip is mounted within the opening of a lead frame by bonding wires extending between the active front side of the chip and bonding pads of the lead frame, and the lead frame/chip assembly is encased. within a plastic molded body, with the inactive back side of the chip exposed and facing outside the package. |
申请公布号 |
SG38849(A1) |
申请公布日期 |
1997.04.17 |
申请号 |
SG19950000743 |
申请日期 |
1995.06.27 |
申请人 |
DIGITAL EQUIPMENT CORPORATION |
发明人 |
HAMBURGEN WILLIAM RIIS;FITCH JOHN STUART;DORDI YEZDI NAVAL |
分类号 |
H01L23/28;H01L21/56;H01L23/16;H01L23/31;H01L23/433 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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