Verfahren zum Verbinden eines IC-Chips mit einem mit Leitermuster versehenem Substrat

摘要

A connecting method of connecting an integrated circuit chip (11) to a wiring substrate (13) having a wiring pattern formed thereon, according to the present invention, is intended to make a connection between fine connecting portions on the substrate and connecting pads (12) on the chip easy and reliable. The connecting method of this invention is featured by connecting a plurality of connecting portions (14) formed on a major surface of a wiring substrate to a plurality of connecting pads (12) formed on a major surface of an integrated circuit chip through metal bumps (15) and adhering portions of the major surface of the wiring substrate which have no connecting portions to portions of the major surface of the integrated circuit chip which have no connecting pads by means of a photothermosetting resin film (16) selectively opened at the connecting portions.