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发明名称
High purity tin@ alloy target material for sputter coating process
摘要
High purity tin alloy for use in sputter coating contains (by wt.%) 0.01-0.7 Cu and 0.001-0.3 Al.
申请公布号
DE19538365(A1)
申请公布日期
1997.04.17
申请号
DE19951038365
申请日期
1995.10.14
申请人
LEYBOLD MATERIALS GMBH, 63450 HANAU, DE
发明人
SCHLOTT, MARTIN, DR., 63454 HANAU, DE;HEINDEL, JOSEF, 63512 HAINBURG, DE;OTTE, HENNING, 61169 FRIEDBERG, DE
分类号
C22C13/00;C23C14/34;(IPC1-7):C22C13/00
主分类号
C22C13/00
代理机构
代理人
主权项
地址
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