Chipträger zum Herstellen einer Mikrowellen-Halbleiteranordnung hoher Leistung durch Anordnen eines Halbleiterchips darauf

摘要

A chip carrier (2) comprises a conductive holder (21) having a chip mounting portion (20), and a insulative collar member (22) having an inner portion. The conductive holder (21) is used to mount a semiconductor chip (1) on the chip mounting portion (20). The shape of the inner portion of the insulative collar member (22) is suitable for an outer shape of the semiconductor chip (1). The insulative collar member (22), which is provided at the periphery of the conductive holder (21), is used to position the semiconductor chip (1). Consequently, the handling of the semiconductor chip (1) having a feeble mechanical strength can be converted to the handling of the chip carrier (2) having a hard mechanical strength, so that the semiconductor chip (1) can be easily mounted on a exact portion of a surface of the package (4) without breaking the semiconductor chip (1).