METHOD OF MANUFACTURING AN ELECTRONIC MULTILAYER COMPONENT

摘要

A method of manufacturing a plurality of electronic multilayer components is disclosed in which each multilayer component comprises alternately stacked electrically conductive layers and electrically insulating layers, the electrically conductive layers being electrically connected in a periodically alternate arrangement to different edges of the multilayer component. The method comprises the steps of providing a substrate which is endowed with a regular pattern of surface protrusions on one face; depositing individual multilayer components into intervening spaces delimited by the protrusions; depositing electrically conductive layers for connection to a given edge of a multilayer component, wherein each connection occurs at an angle ( theta ) of less than 90 DEG with respect to the substrate face in a direction extending towards the surface protrusion delimiting the respective edge; depositing each electrically insulating layer so as to completely cover a preceding electrically conductive layer; after deposition of the desired multilayer composition, planing the side of the substrate on which deposition occurred so as to expose edges of the electrically conductive layers; depositing a connecting body of electrically conductive material over selected groupings of the exposed edges; and separating completed individual multilayer components from one another by severing the substrate along the surface protrusions.