发明名称 |
Apparatus for and method of polishing workpiece |
摘要 |
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. A guide ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force. |
申请公布号 |
EP0768148(A1) |
申请公布日期 |
1997.04.16 |
申请号 |
EP19960116163 |
申请日期 |
1996.10.09 |
申请人 |
EBARA CORPORATION |
发明人 |
KIMURA, NORIO;YASUDA, HOZUMI |
分类号 |
B24B37/005;B24B37/04;B24B37/30;B24B37/32 |
主分类号 |
B24B37/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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