发明名称 Clamping structure in air-tightly sealable container
摘要 <p>Proposed is a novel clamping structure between the container body and covering mountable thereon in an air-tightly sealable container such as wafer carriers for semiconductor silicon wafers used for storage and transportation thereof. The clamping structure comprises: (a) a container body and a covering mountable on the container body each provided with an encircling stepped belt around the open periphery, the stepped belts on the container body and the covering being engageable each with the other; (b) a pair of engagement ribs each having an engagement groove and protruded on the open periphery of each of the container body and the covering at oppositely facing positions; and (c) an engagement board which is a resin plate provided with a U-shaped openwork notch at the center thereof in the longitudinal direction, the notch being engageable at the upper part thereof with the engagement groove in the engagement rib of the covering and engageable at the lower part thereof opposite to the upper part with the engagement groove in the engagement rib of the container body. <IMAGE></p>
申请公布号 EP0768706(A2) 申请公布日期 1997.04.16
申请号 EP19960402136 申请日期 1996.10.08
申请人 SHIN-ETSU POLYMER CO., LTD.;SHIN-ETSU HANDOTAI COMPANY LIMITED 发明人 HOSOI, MASATO
分类号 B65D85/86;H01L21/027;H01L21/673;(IPC1-7):H01L21/00 主分类号 B65D85/86
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