| 摘要 |
A method for depositing synthetic diamond film on a substrate, including the following steps: pre-stressing the substrate to obtain a pre-deposition stress across a surface thereof; depositing the diamond film on the pre-stressed substrate surface; and cooling the film and substrate, and relieving the pre-deposition stress during the cooling. When the substrate has a higher coefficient of thermal expansion than the diamond film, the pre-stress is a compressional stress. When the substrate has a lower coefficient of thermal expansion than diamond film, the pre-stress is a tensile stress.
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