ADHESIVE TAPE FOR SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To obtain an adhesive tape consisting of a supporting film and an adhesive agent layer consisting of a specific resin, less in ionic impurity, excellent in electric current leak characteristic and adhesive property, and useful as a lead frame fixing tape, etc. SOLUTION: This adhesive tape for a semiconductor consists of (A) a supporting film and (B) preferably an adhesive agent layer consisting of an alicyclic solid epoxy resin expressed by formula I. Further, it is preferable for the adhesive layer of the component (B) to contain a latent curing agent consisting of dicyandiamide and to be in a semi-cured state. A compound of the formula I is obtained e.g. by a preparation using a direct oxidation method of a double bond with peracetic acid as expressed by formula II.