发明名称 Method of manufacturing a semiconductor memory device having a capacitor
摘要 In a semiconductor memory device having a novel structure of a wiring layer and a large capacitance capacitor and the manufacturing method therefor, on the transistor formed on the semiconductor substrate, a first conductive layer is formed extending along with the gate electrode of the transistor and connecting with the gate electrode, a storage electrode of a capacitor is formed on the first conductive layer by interposing the insulation film between the first conductive layer and the source region of the transistor, and a second conductive layer is formed in connection with the first conductive layer at a portion between memory cell array and the peripheral circuit region. Storage electrodes can be made thicker without affecting to the step-difference between memory cells and the peripheral circuit region, so that a more reliable semiconductor memory device with a capacitor having a larger capacitance can be realized.
申请公布号 US5620917(A) 申请公布日期 1997.04.15
申请号 US19960615087 申请日期 1996.03.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOON, JOO-YOUNG;NAM, IN-HO
分类号 H01L27/10;H01L27/105;H01L27/108;(IPC1-7):H01L21/70;H01L27/00 主分类号 H01L27/10
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