| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat resistance of a plastic card by forming a card core and an oversheet of heat resistant plastic, and forming an adhesive layer of thermosetting adhesive having thermoplastic resin having a lower softening point than that of the plastic and heat curing agent. SOLUTION: An IC card is obtained by executing print designs 5 on both side surfaces of a card core 3 having a multilayer structure made of heat resistant plastic and laminating a transparent oversheet 2a made of heat resistant plastic on the front surface side of the core 3 via a transparent adhesive layer 4a and a transparent oversheet 2b made of heat resistant plastic on the rear surface of the core 3 via a transparent adhesive layer 4b. The core 3 is obtained by laminating two white core sheets 3a, 3b made of heat resistant plastic via a white adhesive layer 4c. The layers 4a, 4b, 4c are formed of thermosetting adhesive having thermoplastic resin having lower softening point than that of the heat resistant plastic and heat curing agent. |
