| 摘要 |
PCT No. PCT/FR94/00893 Sec. 371 Date Jan. 18, 1996 Sec. 102(e) Date Jan. 18, 1996 PCT Filed Jul. 18, 1994 PCT Pub. No. WO95/03684 PCT Pub. Date Feb. 2, 1995This circuit comprises an insulating substrate covered on at least part of its surface by a fine conducting layer (7) whose geometrical form corresponds to the layout chosen for the circuit; the said conducting layer having one or more very fine grooves (9) with a depth of more than 1 mu m engraved in the substrate; the groove or grooves (9) being completely filled by at least two superimposed components: the first, situated at the bottom of the groove, consisting of a highly conductive material, (conducting wire or conducting section, or a conducting substance produced by treatment of a liquid, powdery or pastelike precursor material previously positioned in the groove); the second, which seals the groove, being produced by treatment of a liquid powdery or pastelike precursor material (11), which may or may not be conducting; the treatments having imparted to the said precursor materials their solid consistency and their final properties; the conducting layer (7) being deposited in such a way that it is in contact with the conducting components(s) positioned in the groove before filling, at an intermediate stage, or after the sealing of the groove. |
