| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized semiconductor light emitting module of high luminance which has sharp optical directivity and large optical output, by using a chip type light emitting diode needing no outer leads, forming an inner lens in the light emitting diode, and combining the inner lens with an outer lens. SOLUTION: A plurality chip type of semiconductor light emitting devices 12 which are mutually electrically connected by wiring conductor 16 for connection, and an outer lens 15 for condensing a light emitted from the semiconductor light emitting devices 12 are arranged on one main surface 11a side of a circuit board 11. A light emitting device substrate 22 on which two mutually isolated light emitting device wiring conductors 25, 26, and a light emitting device lens composed of light transmitting resin sealing a semiconductor light emitting device 23 and lead thin wires 27 are arranged. On the main surface of the outer lens 15 side, a spherical inner lens 24d is formed. Further on the other main surface 11a of the circuit board 11, a reflecting wall 13 is vertically formed in the vicinity of a plurality of the semiconductor light emitting devices 12, and the lights emitted from them are reflected to the outer lens 15 side by the reflecting wall 13. |
