发明名称 |
ELEKTROPLATTIERTE KUPFERFOLIE UND DEREN HERSTELLUNG UNTER VERWENDUNG ELEKTROLYTISCHER LÖSUNGEN MIT NIEDRIGEN KONZENTRATIONEN VON CHLOR IONEN |
摘要 |
This invention relates to electrodeposited copper foil having an elongation measured at 180 DEG C. in excess of about 5.5%, an ultimate tensile strength measured at 23 DEG C. in excess of about 60,000 psi, and a matte-side Rtm in the range of about 4.5 to about 18 mu m. This invention also relates to a process for making electrodeposited copper foil which comprises: preparing a copper deposition bath comprising water, copper ions and sulfate ions, said bath containing less than about 20 ppm chloride ions; and applying electric current to said bath to electrodeposit copper from said bath using a current density in the range of about 200 to about 3000 amps per square foot. |
申请公布号 |
AT151474(T) |
申请公布日期 |
1997.04.15 |
申请号 |
AT19910911599T |
申请日期 |
1991.05.24 |
申请人 |
GOULD ELECTRONICS INC. |
发明人 |
CLOUSER, SIDNEY, J.;DIFRANCO, DINO, F.;HASEGAWA, CRAIG, J. |
分类号 |
H05K1/09;C25D1/04;C25D3/38;C25D7/06;H05K3/38;(IPC1-7):C25D1/04 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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