| 摘要 |
PROBLEM TO BE SOLVED: To increase the number of pins, reduce the arranging pitch of the pins, and improve the heat radiating characteristic and mountability by housing a semiconductor chip in a recessed section formed at the central part of a substrate and forming a plurality of ball-like external electrodes on the upper surface side of the chip, and then, closing the recessed section with a lid and forming thermal via holes on the lower surface side of the chip. SOLUTION: A semiconductor chip 9 is housed in a recessed section formed at the central part of a substrate 1 and a plurality of ball-like external electrodes 14 is formed on the upper surface side of the chip 9. The recessed section is closed with a lid 11 and thermal via holes 2 are formed on the lower surface side of the chip 9. The via holes 2 are formed by plating copper through holes. The via holes 2 are filled up with a resin. When the area of the lid 11 is >=300mm<2> , in addition, the lid 11 is made of a ceramic. |
