| 摘要 |
PCT No. PCT/FR94/00860 Sec. 371 Date Apr. 12, 1996 Sec. 102(e) Date Apr. 12, 1996 PCT Filed Jul. 11, 1994 PCT Pub. No. WO95/02715 PCT Pub. Date Jan. 26, 1995A method comprising the steps of (a) preparing a divided copper oxide dispersion (4) including a solvent and a selected binder, (b) applying said dispersion to a non-conductive substrate (1) to form a film (5), (c) forming a Cu film (9) with a suitable reagent, and (d) electrolytically depositing at least one metal film (11) on said film (9). |
