BONDING OF ADHESIVE APPLIED POLYIMIDE TAPE AND STAINLESS STEEL PLATE

摘要

PROBLEM TO BE SOLVED: To perform surface treatment improving the surface wettability of a stainless steel plate before bonding processing in order to enhance the bonding strength of an adhesive applied polyimide tape and a stainless steel plate. SOLUTION: In the bonding processing of an adhesive applied polyimide tape and a stainless steel plate, treatment such as shot blast using inorg. particles or grinding is applied to the stainless steel plate and/or the stainless steel plate is washed with an aq. soln. containing ferric chloride and hydrochloric acid and dried before lamination.