| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a film such as conductive film on a thin ceramic board or on a baked film formed on a ceramic board, without generating cracks. SOLUTION: A ceramic board 40 or a baked film formed on the ceramic board 40 is coated with a filmy body 46, which is to be a metal film or a ceramic film, by baking. The filmy body 46 is trimmed by irrdiation with energy beams which decompose and remove the filmy body 46 without damaging the ceramic board 40 or the baked film to be unusable. Then, the filmy body 46 is baked. |
