| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink for cooling electronic components which can cope with the increase of the generating quantity of heat of electronic components, has a small size and a light weight, and can efficiently cool the electronic components. SOLUTION: A plurality of heat radiating fins 3 is provided on the surface of the base 2 of a heat sink 1 so that the fins 3 can surround the impeller of an air blower. A thick heat generating section composed of linear ribs 4 and an annular rib 5 is provided in the area of the base 2 surrounded by the fins 3. The ribs 4 and 5 are made thicker than a heat radiating fin installing section 6 in which the fins 3 are provided and, at the same time, form a pattern which reduces the resistance of heat transfer between a heat generating source corresponding section 7 corresponding to the heat generating source of electronic components and the heat radiating fin installing section 6. |
