MEGATIVE PHOTORESIST RESIN COMPOSITION

摘要

A dry film photoresist type photo hardening resin composite suitable to use in manufacturing a printed circuit board is disclosed. The photo hardening resin composition includes a coupling agent high polymer, a photo polymerization agent, and a photo polymerization monomer. The photo polymerization monomer includes a multi-functional photo polymerization monomer of a predetermined general expression. The dry film photo resist according to the present invention has a short development time, a good close adhesion feature, a good hardness, and a good flexibility.