PCMCIA standard memory card package

摘要

A method for manufacturing a package 10 for a memory card 28. The method includes the steps of mating plastic frames around a PCB containing semiconductor devices, encapsulating frames and PCB within two stamped metal outer covers, that are then bonded together by a form of welding or by using an adhesive. The plastic frame elements 16, 18 are introduced in the method by an injection molding process.