| 摘要 |
<p>A method and apparatus, and variations of each, for inspecting a wafer (14) defining at least one die thereon, first obtains the electronic image (56) equivalent of two dies, and then determines the x and y offset (50) between those electronic images (60). Prior to inspection for defects (74), those two electronic images (60) are aligned (62) by adjusting the x and y positions (66) of one electronic image (56) of one die with respect to the electronic image (56) of the other die. Once that is accomplished, those electronic images (60) are compared to detect any defects (74) that may exist on one of the dies.</p> |
