发明名称 ARRANGEMENT IN COOLING ELECTRONIC EQUIPMENT
摘要 <p>The invention comprises an arrangement that may be used for cooling electronic equipment (10), where said electronic equipment is housed in a rack arrangement (1') with means (11, 12) for transferring the heat energy produced by said equipment to one or more rack-related cooling units (13, 14), each of which is designed to transfer heat energy by means of convection to the ambient air about the rack and the equipment. At least one of said cooling units (14) contains vertically-oriented cooling flanges (14a, 14b), positioned next to one another, and a fan unit (20) that is designed to be able to provide, on demand, the cooling unit and the cooling flanges with a stream of forced air, thereby increasing heat emission from the cooling flanges to the ambient air. The fan unit (20) is located at the side of a rack unit (1'), and positioned beside, or part way inside, the cooling unit (14). The fan unit (20) is arranged to provide a stream of forced air (A) to each space that is formed between the flanges (14a, 14b) of the cooling unit; the flow of said stream of forced air (A) is restricted to within the area for the sections of the cooling unit flanges that faces towards the rack unit (1'). The stream of air (A) produced for several collateral spaces (22) is aimed to flow in an upward direction.</p>
申请公布号 WO1997013394(A1) 申请公布日期 1997.04.10
申请号 SE1996001230 申请日期 1996.10.01
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