发明名称 CONNECTION DEVICE FOR HIGH-DENSITY PARALLEL WIRE ASSEMBLIES
摘要 <p>A device including a mounting (1) with a blade (3) provided with a window (10) for receiving sheathed wires, as well as a clip (17) mounted on a sliding member (15) that is transversely movable relative to the sheaths (32, 33), and comprising means (23) for gripping the wire sheaths (32, 33) and drawing them to the back (6) of the mounting (1) where the clip and the blade (3) together strip the wires (30, 31) lengthwise. The receiving window (10) of the blade (3) is open outwards so that wires may be positioned in mutually transverse positions in which they are parallel to the movement of the slide member (15) relative to the mounting (1).</p>
申请公布号 WO1997013294(A1) 申请公布日期 1997.04.10
申请号 FR1996001502 申请日期 1996.09.26
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