| 摘要 |
A lead frame for a semiconductor module comprises a lead frame member having first and second islands and including first, second and third groups of outer leads. The first and second groups of outer leads are located in one direction at opposed sides of the lead frame member, and the third group of outer leads are located between the first and second islands in the direction. When the first and second semiconductor chips are mounted on the first and second islands, respectively, and encapsulated separately with a resin layer, the third group of outer leads serve as external leads. |
