High-strength copper based alloy free from smutting during pretreatment for plating

摘要

A high-strength Cu based alloy, consists essentially of: Ni: 0.5 to 2.0 %; Sn: 1.2 to 2.5 %; Si: 0.04 to 0.1 %; Zn: 0.1 to 1 %; Mg: 0.0001 to 0.02 %; Mn: 0.0001 to 0.1 %; P: 0.0001 to 0.02 %; and Cu and inevitable impurities: the balance, wherein the total content of Mg, Mn and P is 0.001 to 0.12 %. The Cu based alloy is suitable for use as a material of electrical and electronic parts, and free from smutting during pretreatment for plating thereof.