发明名称 |
Method of modifying an exposed surface of a semiconductor wafer |
摘要 |
A method of modifying an exposed surface of a semiconductor wafer that includes the steps of: (a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abrasive particles and a binder in the form of a pre-determined pattern; and (b) relatively moving the wafer and the fixed abrasive article to modify said surface of the wafer. |
申请公布号 |
AU7241396(A) |
申请公布日期 |
1997.04.09 |
申请号 |
AU19960072413 |
申请日期 |
1996.09.19 |
申请人 |
MINNESOTA MINING AND MANUFACTURING COMPANY |
发明人 |
WESLEY J BRUXVOORT;SCOTT R CULLER;KWOK-LUN HO;DAVID A KAISAKI;CARL R KESSEL;THOMAS P KLUN;HEATHER K. KRANZ;ROBERT P. MESSNER;RICHARD J WEBB;JULIA P. WILLIAMS |
分类号 |
B24B1/00;B24B7/22;B24B21/04;B24B37/04;B24B53/007;B24B53/017;B24D3/00;B24D3/02;B24D3/28;B24D11/00;H01L21/304;H01L21/3105 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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