| 摘要 |
<p>PROBLEM TO BE SOLVED: To perform die bonding on a package regardless of the structure of the package by providing a pickup tool which makes rotary motions after picking up a semiconductor chip from a wafer. SOLUTION: A chip pick-up and transfer section 51 is provided with a second pickup tool 58 which picks up a semiconductor chip from a wafer 50, a first pickup tool 48 which moves the semiconductor chip received from the tool 58 to a stage 52, and a stopper 59 which positions the tools 58 and 48. The tool 58 can make rotary motions by 180 deg., 360 deg., etc. Therefore, the direction of the working surface of the semiconductors chip stuck to a lead frame can be adjusted freely and the section 51 can be applied to any kind of semiconductor in which semiconductor chips are stuck to LOC packages, COL packages, or lead frame pads.</p> |
