Semiconductor package and method for assembling the same

摘要

A semiconductor package including a semiconductor chip having at its upper surface a plurality of bonding pads and a tape lead frame having a paddle on which a semiconductor chip is laid, a plurality of inner leads each having a sufficient length to be directly connected with each corresponding bonding pad of the semiconductor chip and a plurality of outer leads each connected with each corresponding inner lead and having a thickness larger than that of the inner lead. The semiconductor chip is die bonded on the paddle of the tape lead frame. An insulating layer is formed over the upper surface of the semiconductor chip except for portions corresponding the bonding pads. Each inner lead has at its one end a bonding bumper for electrically connecting the inner lead with each corresponding bonding pad. Using the epoxy molding compound, the inner leads and the paddle of the tape lead frame, the semiconductor and the insulating layer are molded. Each of the outer leads has a predetermined shaped portion exposed externally from the package.