Aluminum-based solder material

摘要

A solder material that is especially suitable for the fluxless hard soldering of aluminum-based components consists of an aluminum-based alloy that especially contains about 10 to 50 wt. % of germanium, about 1 to 12 wt. % of silicon, about 0.1 to 3 wt. % of magnesium, and about 0.1 to 3 wt. % of indium. The solder material is useful at soldering temperatures in the range from 424 DEG to about 600 DEG C., and is therefore especially suitable for the fluxless hard soldering of components made of precipitation-hardened high-strength aluminum-based materials.