发明名称 MANUFACTURE OF HYBRID INTEGRATED CIRCUIT
摘要 <p>PROBLEM TO BE SOLVED: To improve the film quality of a printed resistance in which a coating film formed on a thick-film metal board, a solvent and an organic material are contained. SOLUTION: A printed-resistance paste is printed, and the inside of a coating film 5 is then dried by a heater 30 which radiates far-infrared rays. In addition, heat is applied by a heater 31 at the lower part of a board 11, and heat which escapes to the outside via the board is suppressed. Consequently, the coating film can be dried from a part near the interface between the board and the coating film.</p>
申请公布号 JPH0997962(A) 申请公布日期 1997.04.08
申请号 JP19950253880 申请日期 1995.09.29
申请人 SANYO ELECTRIC CO LTD 发明人 IGARASHI YUUSUKE;TAKAKUSAKI SADAMICHI
分类号 H05K1/16;H01C7/00;H05K3/44;(IPC1-7):H05K1/16 主分类号 H05K1/16
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