| 摘要 |
PROBLEM TO BE SOLVED: To uniformize the temperature distribution on an island part so as to eliminate difference in the curing speed of adhesive, etc., uniformize the die shear strength for stabilization and improve the product quality and yield. SOLUTION: At the time of heating a lead frame 2 by placing the lead frame 2 on a heat block 4 so as to fix an IC pellet on the island part 2a of the lead frame 2 by using thermosetting adhesive, the lead frame 2 is slightly floated from the block 4 by using protruding jigs 5 and 5. |
