SEMICONDUCTOR DEVICE, ITS MANUFACTURE AND ADHESIVE MEMBER FOR DICING

摘要

PROBLEM TO BE SOLVED: To eliminate or reduce package cracks and improve the workability of mount cure and mounting by fixing a semiconductor element to a mounting part on the rear plane with thermoplastic adhesive. SOLUTION: A mount pad 81 which mounts an IC chip 10 is formed smaller than the IC chip 10 as a small die pad, and the mount pad 81 is not provided with a recessed part which is to be filled with mounting material. That is, the IC chip 10 is fixed to the mount pad 81 on the rear plane with adhesive 84 which contains thermoplastic polyimide as major component. Since the thermoplastic adhesive is used as mounting material, phreatic explosion, which occurs, when silver paste is used and is heated owing to the absorbed moisture, does not occur. Thus, a highly reliable package without or reduced package cracks is obtained.