POLISHING PAD, POLISHING DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a polishing device which is capable of making a semiconductor wafer constant in pressure distribution throughout its polishing surface and enhancing in-plane uniformity of polishing speed. SOLUTION: A polishing device is used for carrying out CMP, wherein the device is equipped with a polishing pad 93 for polishing a semiconductor wafer 92, an air mat 94 composed of fine bags which are hermetically filled with air and regularly arranged to support the polishing pad 93 two-dimensionally, a pressing mechanism which presses the polishing pad 9 against the wafer 92 through the intermediary of the air mat 94, and a sliding mechanism which slides the polishing pad 93 and the wafer 92.