SEMICONDUCTOR WAFER CARRIER

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer carrier which is capable of preventing a semiconductor wafer from deteriorating in evenness at etching by a method wherein the semiconductor wafer is set large in area exposed to etching solution and coming uniformly into contact with etching solution. SOLUTION: A wafer carrier main body 1 possessed of an open top and a bottom and inner sides provided with opposed support grooves where a large number of semiconductor wafers are placed separate from each other is formed into a shape of low profile. Side plates 2 and 3 are provided in the carrier main body 1 extending vertically downwards, ribs 2a to 2n and ribs 3a and 3n are provided to the inner surfaces of the side plates 2 and 3 extending both inwards and vertically downwards and confronting each other, and wafer support rods 8 and 9 are provided below the ribs 2a to 2n and ribs 3a and 3n and in parallel with and adjacent to the side plates 2 and 3 bridging a space between a front plate 4 and a rear plate 5. Semiconductor wafers inserted into opposed wafer support grooves made up with the ribs 2a to 2n, and 3a to 3n are supported by the support, rods 8 and 9 in a two-point support manner.