CARRIER AND MANUFACTURE OF ELECTRONIC COMPONENT AS WELL AS MOUNTING METHOD FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a carrier which is suitable for mounting a plurality of electronic components collectively when the electronic components with bumps are manufactured. SOLUTION: A plurality of sets of mounting parts to be formed are composed of first mounting parts 2 on which a plurality of electronic components with bumps formed on one face can be mounted and which hold electronic components in a state with one face upward directed and of second mounting parts which hold electronic components in a state with one face downward directed and which are situated on the surface-and-rear reversed side with reference to the first mounting parts 2.