| 发明名称 |
Thermosetting silicone gum composition |
| 摘要 |
<p>A thermosetting silicone gum composition that has a rapid curing speed and excellent mold-releasability. The composition comprises (A) silicone base, (B) organic compound mold release agent, (C) organohydrogen polysiloxane, (D) water, and (E) organic peroxide.</p> |
| 申请公布号 |
EP0767207(A1) |
申请公布日期 |
1997.04.09 |
| 申请号 |
EP19960306662 |
申请日期 |
1996.09.13 |
| 申请人 |
DOW CORNING TORAY SILICONE COMPANY LIMITED |
发明人 |
HONMA, HIROSHI D;MATSUSHITA, TAKAO |
| 分类号 |
C08K3/04;C08K3/18;C08K3/36;C08K5/00;C08K5/14;C08L83/04;C08L83/05;(IPC1-7):C08K13/02 |
主分类号 |
C08K3/04 |
| 代理机构 |
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代理人 |
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| 地址 |
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