发明名称 MANUFACTURE OF HYBRID INTEGRATED CIRCUIT
摘要 <p>PROBLEM TO BE SOLVED: To improve the film quality of a printed resistance in which a coating film formed on a thick-film metal board, a solvent and an organic material are contained by a method wherein the metal board is conveyed by a metal belt which conducts the heat of a heating body installed at the lower part and it is fired while it is being conveyed. SOLUTION: Hot plates 22 as heat sources are mounted under a metal belt 21. From the viewpoint of thermal efficiency, it is required that the hot plates 22 and the belt 21 as well as the belt 21 and a board 11 come into face contact over their substantially whole faces. For this, the metal belt 21 is preferably a mesh belt. Concretely, a belt in which small chains are tied to be a matrix shape such as a metal belt for a watch or a belt in which a metal thread is knitted to be a cloth shape is preferable. The belt such as the metal belt for the watch or the belt in which the metal thread is knitted to be the cloth shape is flexible, the belt 21 comes satisfactorily into contact with the hot plate 22 due to its own weight, and the board 11 can be conveyed while it is brought into contact with the belt 21 satiafactorily. Then, the board 11 is formed while it is being conveyed by the belt 21.</p>
申请公布号 JPH0997961(A) 申请公布日期 1997.04.08
申请号 JP19950253879 申请日期 1995.09.29
申请人 SANYO ELECTRIC CO LTD 发明人 IGARASHI YUUSUKE;TAKAKUSAKI SADAMICHI
分类号 H05K1/16;H01C7/00;H01L23/12;H05K3/44;(IPC1-7):H05K1/16 主分类号 H05K1/16
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