ELECTROSTATIC CHUCK HOLDER, WAFER HOLDING MECHANISM AND USING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To enhance efficiency in the heating and cooling of wafer at the time of deposition and to sustain the temperature of an electrostatic chuck holder at high level at the time of plasma screening by differentiating the heat transmission efficiency between an electrostatic chuck and the cooling body of electrostatic chuck holder at the time of deposition and plasma screening. SOLUTION: The wafer holding mechanism has a laminar gas injection space extending in parallel with the wafer holding face of an electrostatic chuck. More specifically, the gas injection space 12B is defined by the upper surface of a cooling block 12 on the electrostatic chuck 1 side and the lower surface of an insulating plate 11 incorporating a heater 11A.