MULTILAYER INTERCONNECTION CIRCUIT BOARD AND ITS PRODUCTION METHOD AND PRODUCTION SYSTEM

摘要

PROBLEM TO BE SOLVED: To obtain a multilayer circuit board which is suitable for the high density mounting and mass-production and can meet the requirements caused by process defects and logic change quickly by a method wherein at least one stacking pad group among a number of stacking pad groups is electrically isolated from the upper and lower stacking pad groups adjacent to it with insulators provided between the pads of the adjacent layers. SOLUTION: A multilayer interconnection circuit board 31 is composed of ceramic circuit boards 1 on which circuits are printed by a thick film process and piled and sintered and thin film wiring layers 2 which have thin film wirings, pads, etc., and are formed on the ceramic circuit boards 1. A number of LSI chip components 14 are mounted on the terminal joint pads 12 formed on the surface of the thin film wiring layer 2 and bonded with bonding members such as solder balls to constitute a multichip module. I/O pins 33 provided on the respective rears of a plurality of the multilayer interconnection circuit boards 31 are inserted into connectors 34 provided on a printed circuit board 33 to constitute a large scale electronic circuit module device.