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发明名称
METHOD FOR PLASMA ETCHING OF SILICON MATERIAL LAYER
摘要
申请公布号
JPH0992644(A)
申请公布日期
1997.04.04
申请号
JP19950250942
申请日期
1995.09.28
申请人
SONY CORP
发明人
YANAGIDA TOSHIHARU
分类号
C23F4/00;H01L21/302;H01L21/3065;(IPC1-7):H01L21/306
主分类号
C23F4/00
代理机构
代理人
主权项
地址
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