发明名称 FORMING METHOD OF THICK FILM PATTERN
摘要 PROBLEM TO BE SOLVED: To enhance mechanical strength, and perform the whole process by dry work in a bright room by forming a pattern forming layer on a base board, and layering an adhesive sheet on the pattern forming layer. SOLUTION: (a) Paste for a partition wall is applied onto a base board where a dielectric layer 3 is formed on an electrode pattern 2 as a thick film. (b) A pressure sensitive adhesive is applied to a contact surface on which easily adhesive processing of a polyester film is performed, and it is dried, and a pressure sensitive adhesive layer is formed by ageing it, and is superposed on (a). A carbon dioxide gas laser is used to irradiate, and a line pattern is plotted. An unnecessary part is removed by sand blast work. The pressure sensitive adhesive layer rich in a foaming agent is expanded by heat treatment, and the pressure sensitive adhesive layer is separated. It is baked at a prescribed temperature, and a partition wall forming material is bound to a glass substrate. Therefore, fixing, a broken piece or the like of carbide are not caused, and an excellent partition wall having high surface smoothness can be formed.
申请公布号 JPH0992136(A) 申请公布日期 1997.04.04
申请号 JP19950272114 申请日期 1995.09.27
申请人 DAINIPPON PRINTING CO LTD 发明人 KAFUKU MASAAKI
分类号 B32B9/00;B29C67/04;B29K105/04;B29L9/00;C04B41/91;C09J5/08;C09J7/02;C09J201/00;H01J9/02;H01J9/14;H05K3/04;(IPC1-7):H01J9/02 主分类号 B32B9/00
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