| 摘要 |
PROBLEM TO BE SOLVED: To enable easy and quick working for preliminarlly fixing an adhesive conducting film to an IC chip, by forming positioning marks for sticking the adhesive conducting film, on a printed board. SOLUTION: Resist is exposed to light by using a photomask which has positioning marks of '.' at four corners outside a part of face of an IC chip against which part an IC chip abuts. When the resist is peeled after etching, a copper foil layer of the '.' marks are left on the printed board. An adhesive conducting film(ACF) which has been cut into 5mm×6mm is preliminarily stuck to be arranged inside the positioning marks which are used as aims. After the ACF is thermocompression-bonded by a preliminary bonding equipment and sufficiently fixed, a separator of the ACF is peeled. A pad part of the IC chip is made to coincide with and abut against the position of a wiring pattern, and final bonding is performed by heating and pressing. Thus the alignment of the ACF is facilitated in the manufacturing method of an IC module. |
