CONNECTION STRUCTURE FOR SEMICONDUCTOR MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To easily connect and disconnect packages, to reduce costs and to miniaturize a device. SOLUTION: A high frequency coaxial terminal 9 is composed of an external conductor 14, insulator 15 and central conductor 10, and a film-shaped connector 13 is interposed between the high frequency coaxial terminals 9. Then, one protruding terminal part 10a of central conductor 10 is disconnected so as to form the same plane as the end face of external conductor 14 and insulator 15. The film-shaped connector 13 is composed of an insulation film 11 and a lot of metal conductors 12 passed through this film and the metal conductors 12 are distributedly arranged in the shape of matrix.